HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate
PCB Specifications:
1 Part NO: HDIPCB0005
2 Layer Count: 10 Layer HDI PCB
3 Finished Board Thickness: 1.0MM
4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,
L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM
5 Min Lind Space&Width: 3/3mil
6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1
7 Application Area: Optical Module
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
IT180A Data Sheet:
| Items |
IPC TM-650 |
Typical Value |
Unit |
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil |
2.4.8 |
5
8 |
lb/inch |
| Volume Resistivity |
2.5.17.1 |
1x109 |
M-cm |
| Surface Resistivity |
2.5.17.1 |
1x108 |
M |
| Moisture Absorption, maximum |
2.6.2.1 |
0.10 |
% |
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz |
2.5.5.9
2.5.5.9 |
4.5
4.4 |
-- |
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz |
2.5.5.9
2.5.5.9 |
0.014
0.015 |
-- |
Flexural Strength, minimum
A. Length direction
B. Cross direction |
2.4.4 |
500-530
410-440 |
N/mm2 |
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched |
2.4.13.1 |
Pass Pass |
Rating |
| Flammability |
UL94 |
V-0 |
Rating |
| Comparative Tracking Index (CTI) |
IEC 60112 / UL 746 |
CTI 3 (175-249) |
Class (Volts) |
| Glass Transition Temperature(DSC) |
2.4.25 |
175 |
˚C |
| Decomposition Temperature |
2.4.24.6 |
345 |
˚C |
| X/Y Axis CTE (40℃ to 125℃) |
2.4.41 |
11-13 / 13-15 |
ppm/˚C |
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C |
2.4.24 |
45
210
2.7 |
ppm/˚C ppm/˚C
% |
Thermal Resistance
A. T260
B. T288 |
2.4.24.1 |
>60
20 |
Minutes Minutes |
Product Tags:
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1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate Images
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